The IAAC-Colette Industry Scholarships
The Postgraduate in 3D Printing Architecture is a 6 month full-time course aimed at architects, engineers, designers, material engineers, mechanical engineers and construction professionals willing to specialise in this new technology, and willing to explore how it will shape the way we think, design and build a more sustainable habitat.
Project Colette together with IAAC wishes to support this new generation and help them propose a new sustainable architecture and urbanism capable to face the challenges of our century.
For 2023, two full scholarships are available for students from Asia, Africa or South America to take part in the 3D Printing Architecture program (equivalent to 11.925€ each). This allows young talents who might not have the resources to take part in an educational program abroad to learn new technologies and design strategies. These strategies can then be applied in the local contexts of fast growing cities.
Programme Duration: 6 months – September 2023 to February 2024 – Full Time
This course is designed for Architects, Engineers, Designers and professionals from the construction industry.
Scholarships are available for:
- Students from Asia
- Students from Africa
- Students from South America
Eligible students need to hold a passport from an Asian, African or South American country and have successfully completed an educational program in the fields of Architecture, Design, Engineer, Material science.
Description of the Scholarship
Industry Scholarship Award:
2 Full Scholarships on the 3DPA tuition fee.
Normal tuition fee for non-scholarship positions is:
3DPA: Non-EU: 11.925€ // EU: 9.900€ // Spanish: 5.963€
Duration of the program:
3DPA: 6 months – September 2023 to February 2024 – Full Time
Language of the Master:
31st March 2023 – 23:59 (CET)
How to apply for the scholarship?
To apply, each candidate should visit the Application Portal, register their profile, and fill out the IAAC-Colette Industry Scholarships form. In the programme selection they should select 3DPA as their programme of interest and then proceed to fill out the necessary personal information as well as uploading the mandatory supporting documents.
The full list of mandatory supporting documents to submit for the Industry Scholarship are the following:
1) Letter of intent written in English
2) A Portfolio showcasing samples of your work in English
3) CV (Curriculum Vitae/ Resume).
4) Two letters of recommendation written in English
5) A scanned copy of your bachelor’s diploma.
6) A copy of your valid passport
7) Submit a 2 page illustrated A4 document with a 400 word description and images. It should answer the question, “What is your vision for a 3d printed architecture?”
Important: A 50€ Application fee (non-refundable) is to be paid to submit your application.
For more detailed information on the Supporting Documents listed above please consult the IAAC Guide for Applicants.
Submission Deadline: 31st March 2023 – 23:59 (CET)
Winners announced within 17th April 2023 (CET)
The Selection Process
Students will be evaluated and selected by an academic committee composed of the 3DPA programme directors, faculty and special guests and professionals coming from the field of 3D printing in architecture.
Academic committee members will evaluate the documentation submitted by the students, taking into consideration the following aspects:
- Interest in sustainability in construction
- Interest in new technologies in architecture
- Interest in social approach to architecture
- Evaluation of the motivation presented by the student
- Design skills
Students with the highest evaluation will have access to the second step of the evaluation process, based on an interview via video-conference with members of the academic committee.
The ranking will be published on IAAC website by the 17th April 2023.
Selected candidates will have to accept and enrol in the program signing an agreement before 30th May 2023. Should selected candidates not enrol in the program by the due date, following students in the ranking will be contacted to enrol in the program.